Samsung Electronics reported the start of serial production of uMCP (UFS-based multichip package) multi-chip memory modules – they combine the most advanced LPDDR5 DRAM and UFS 3.1 NAND crystals in one package.
The dimensions of the uMCP module are 11.5 × 13 mm. Thus, integrating DRAM and NAND into a single compact package requires more room for other components. The amount of RAM in such a module can vary from 6 to 12 GB, and a flash drive – from 128 to 512 GB.
Samsung says DRAM has nearly 50% better performance (from 17 to 25 gigabytes per second) and doubled NAN flash bandwidth (from 1.5 gigabytes per second to 3 gigabytes per second) over LPDDR4X-based UFS 2.2. The most noticeable effect of the new memory’s performance gains will be augmented reality applications and 5G networks, where high data rates are significant.
Samsung has completed LPDDR5 uMCP compatibility testing with several global smartphone manufacturers and expects the first devices with the new memory to hit the market this summer.
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